PRODUCT Description

INTRODUCTION
Heat dissipation silica gel is a heat conducting material with low thermal resistance, high thermal conductivity and high flexibility. The high flexibility of the material can reduce the pressure required between components and cover the micro uneven surface, so as to make the components fully contact and improve the heat conduction efficiency. It is especially suitable for the heat conduction demand with limited space

TBL-80 series is a highly transparent two-component addition silicone gel. After the two components are mixed, the viscosity is extremely low. It does not need vacuum degassing. It can be degassed automatically or degassed by a degassing machine. It can be cured at room temperature or heated, and the material does not shrink during curing.

APPLICATION
At present, thermal conductive silicone is widely used in motor controller, power supply, computer and automotive electronics. In addition, chip cooling such as military supplies usually involves contact cooling of electronic devices or mechanical structures. It is used to reduce contact thermal resistance and enhance heat transfer at the contact interface, which will directly improve the performance, accuracy and reliability of the equipment or system itself

•Special for breast pads and stickers - padding for women's underwear

Precise electronic components - potting protection of module power supply and circuit boards with high requirements for transparency and recovery

• Potting of liquid tank filter - sealing and waterproofing of instrumentation

• Silicone puff

ADVANTAGES
 

Very high transparency

• Very low viscosity

• Low linear shrinkage

• 100% solids, no curing by-products

•Operating temperature -50℃~200℃

•Platinum vulcanization is environmentally friendly and non-toxic

• Fast rebound